System Monitor

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Monitor on-chip and off-chip parameters with built-in ADC

The Virtex™-5 FPGA System Monitor provides an integrated solution for thermal management and the measurement of on-chip power supply voltages. Full access to the System Monitor via a JTAG interface enables a powerful tool for debug and testing during hardware development and manufacturing. On-chip access to System Monitor enables incorporation into the overall system management infrastructure for improved performance and reliability. User defined alarms warn of critical temperature or power supply conditions.

System Monitor is built around a fully specified 10-bit 200kSPS (kilo-Sample-Per-Second) general purpose analogue-to-digital converter (ADC). Automatic calibration and self check features ensure accurate and reliable measurements over a temperature range of -40°C to +125°C. The ADC is used to digitize the output of on-chip analog sensors and can also be used to monitor up to 17 external analog inputs for checking environmental aspects of the system performance. System Monitor is fully functional on power up and requires no design effort for basic operation. A complete System Monitor solution is provided by ChipScope™ Pro, CORE Generator™, and ISE™ 9.1i development tools.

Features at a glance:

  • Single-chip solution for monitoring supply voltages and temperature
  • On-chip temperature measurement (±4°C)
  • On-chip power supply measurement (±1%)
  • Easy to use, self-contained
    • Usable before, during, and after device configuration 
    • No design required for basic operation
    • Autonomous monitoring of all on-chip sensors
    • User programmable alarm thresholds for on-chip sensor
  • Built-in, user-accessible 10-bit, 200-kSPS (kilosamples per second) ADC
    • Automatic calibration of offset and gain error
    • DNL = ±0.9 LSBs maximum
  • Up to 17 external analog input channels supported
    • 0V to 1V input range
    • Monitor external sensors e.g., voltage, temperature
    • General purpose analog inputs
  • Full access from fabric or JTAG TAP to System Monitor
  • Fully operational prior to FPGA configuration and during device
    power down (access via JTAG TAP only)
  • Auto chip power down if 125°C is detected on-chip
    • Auto power down disabled by default
Table 1. System Monitor Features and Benefits
Feature Benefit
On-chip temperature measurement Eliminates need for external thermal diode monitoring IC

Guaranteed factory tested accuracy.
On-chip power supply measurement Eliminates need for external ADC

Provides access to power supply measurements inside the package which is not possible with an external ADC
Easy to use No design work for access to basic thermal and power supply monitoring capability. System Monitor is fully functional on power up without the need to configure the FPGA. Therefore System Monitor is available at all stages during the design cycle.
User accessible ADC Supports full access to a general purpose ADC. The ADC is fully specified and can be applied to other applications if required.
Self-check and auto calibration Ensures accuracy over environmental conditions and time
Full access from fabric or JTAG TAP Provides access to the analog measurements (both on-chip and external) via the JTAG interface, enabling a powerful debug and test tool. The JTAG interface does not require any configuration and it therefore always available. Existing JTAG infrastructure analog measurements can easily be retrieved from difficult to access areas. Boundary scan checks in production can include measurements of voltage, temperature, and other analog quantities. 
Fully operational prior to FPGA configuration

Ensures maximum monitoring coverage, since System Monitor is fully functional prior to configuration, during configuration and chip power down. System Monitor can also be used as part of a power on self check during system initialization.

Auto Chip power down

Allows the System Monitor to initiate a chip power down if the on-chip thermal sensor detects a temperature greater than 125°C. This feature can be useful during development or a test with inadequate cooling. An alarm will be issued ~10ms before power down. By default this function is disabled; it must be explicitly enabled by the user.

 
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