XCN09001 - Product Discontinuation Notice (PDF)
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To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products. Was this document helpful? Yes | No
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1.2 |
63 KB |
06/15/2009 |
PCN99008 - A change to the Icc Standby Specification of XC1702L and XC1704L products (PDF)
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1.0 |
19 KB |
10/01/1999 |
PDN98004 - Discontinuation of the XC1718 Product (PDF)
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1.0 |
18 KB |
06/26/1998 |
PDN2003-05 - Discontinue XC18V256 and I-Grade Ordering Codes for the XC18V00 Product Family (PDF)
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1.3 |
58 KB |
09/01/2004 |
PCN95010B - An update to PCN95010A (PDF)
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1.0 |
26 KB |
07/01/1995 |
PCN95010A - An update to PCN95010 (PDF)
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1.0 |
27 KB |
06/28/1995 |
PCN95010 - A New Manufacturer for the Xilinx Serial Configuration PROMs (PDF)
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1.0 |
25 KB |
12/18/1995 |
PCN95003 - Withdrawal of the XC1765DDD8R (Obsolete Device) (PDF)
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1.0 |
16 KB |
04/17/1995 |
XCN06002 - Discontinuation of Certain Military and Radiation-Tolerant Devices (PDF)
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Xilinx is discontinuing certain low-demand military and radiation-tolerant products. Was this document helpful? Yes | No
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1.0 |
52 KB |
01/30/2006 |
XCN07020 - Addition of New Shipping Trays for VO48/VOG48 Packages (PDF)
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Xilinx is adding new shipping trays produced by PCT Technology for the VO48/VOG48 TSOP packages. Was this document helpful? Yes | No
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1.0.2 |
97 KB |
05/23/2008 |
Customer Advisory: Intermittent Synch Word - XC18V00 (PDF)
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Advisory 2003-08: XC18V00 devices with the topmark "ART" are sensitive to noise when operated outside of the data sheet specification (DS026) Was this document helpful? Yes | No
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1.1 |
106 KB |
03/11/2004 |
Customer Advisory 2003-07 Intermittent Synch Word - XCF01S, XCF02S, XCF04S (PDF)
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Advisory 2003-07: XCF01S, XCF02S, and XCF04S devices are sensitive to noise when operated outside of the data sheet specification (DS123). Was this document helpful? Yes | No
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1.0 |
35 KB |
12/16/2003 |
ACN2003-01 - A change in the programming algorithm for the C-grade members of the XC18V00 Family (PDF)
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1.1 |
80 KB |
10/09/2003 |
PCN95001 - Addition of a new process for the Xilinx XC1718D, XC1736D, and XC1765D PROMs (PDF)
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1.0 |
20 KB |
03/31/1995 |
PCN2004-18 - Design Enhancement for the Platform Flash Family of PROMs Manufactured at STMicro (PDF)
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1.1 |
129 KB |
10/25/2004 |
PCN2004-17 - Design Enhancement for the XC18V00 PROMs Manufactured at STMicroelectronics (PDF)
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1.1 |
182 KB |
10/25/2004 |
PCN2003-04A - Update to PCN2003-04 - Extend SCD0799 Availability (PDF)
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PCN2003-04A announces the extension of availability for the XC18V00 family of In-System Programmable Configuration PROMs manufactured at UMC, Taiwan. Was this document helpful? Yes | No
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1.0 |
32 KB |
02/12/2004 |
PCN2003-04 - Additional Manufacturer for the XC18V00 Family of ISP Configuration PROMs (PDF)
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This notification is to inform you of an additional wafer fabrication facility for the C-grade members of the XC18V00 family of In-System Programmable Configuration PROMs. Was this document helpful? Yes | No
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1.3 |
257 KB |
02/12/2004 |
XCN06004 - Mask Set Modification for the XCF08P and XCF16P (PDF)
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This notice describes a mask change to the 8-Mbit and 16-Mbit devices of the Platform Flash™ family of Xilinx
In-System Programmable Configuration PROMs manufactured by STMicroelectronics in Catania, Italy.
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1.0 |
103 KB |
03/20/2006 |
XCN06001 - Re-classification of VOG8 Moisture Sensitivity Level (PDF)
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Moisture-induced delamination on the bond fingers has been observed on the VOG8 package after MSL 1 pre-conditioning. The MSL of this package is therefore being re-classified from MSL 1 to MSL 3 per JEDEC STD-020C. Was this document helpful? Yes | No
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1.1 |
53 KB |
03/02/2006 |
XCU2001-02 - New Xilinx HW-130 Programmer Adapter for the XC17V16 and XC17V08 (PDF)
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1.0 |
20 KB |
03/29/2002 |
XCU010001 - New Marking for XC1800 Series Devices (PDF)
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1.0 |
20 KB |
01/14/2000 |
XCN07015 - Assembly Location and Mold Compound Change for Platform Flash TSOP48 Packages (PDF)
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This notice describes two changes to the 8-Mbit, 16-Mbit, and 32-Mbit Platform Flash devices of the Xilinx In-System Programmable Configuration PROMs manufactured by ST Microelectronics; the assembly and finish plant location change for all TSOP48 packages, and the consolidation of mold compound material to ensure use of the same mold compound across all TSOP48 packages.
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1.0.1 |
190 KB |
09/07/2007 |
XCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)
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Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product. Was this document helpful? Yes | No
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1.0 |
164 KB |
07/16/2007 |
XCN07011 - Revised ICCA Specification for XC1701 and XC17S40 PROM Devices (PDF)
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This notice is to inform XC1701 and XC17S40 family customers of a revision to the worst case ICCA active
mode supply current specification. This revision will not require any changes to a customer's end system. Was this document helpful? Yes | No
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1.0 |
39 KB |
07/09/2007 |
XCN07010 - Product Discontinuance Update (PDF)
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This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx. Was this document helpful? Yes | No
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1.0 |
50 KB |
05/14/2007 |
XCN06024 - Replacement of SAC+ Solder Balls By SACN Solder Balls for Platform Flash FBGA Devices (PDF)
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The purpose of this notice is to inform Xilinx Platform Flash PROM users of a change in the composition of the solder balls for the Pb-free 48TFBGA (FSG48) packages. Was this document helpful? Yes | No
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1.0 |
25 KB |
01/01/2007 |
PDN2002-09 - Discontinue M-Grade QPro XQ18V04 (PDF)
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2.0 |
45 KB |
10/20/2008 |
XCN08005 - Test Location and Topside Marking Change for Platform Flash and XC18V Flash Memory Devices (PDF)
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This notice is to communicate a change in the test equipment/location for all devices and the topside part marking for many devices in the Platform Flash (XCF) and XC18V families of flash memory configuration devices.
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1.0 |
77 KB |
02/16/2009 |
XCN08009 - Fab Location Change for Platform Flash and XC18V00 PROMs Flash Memory Devices (PDF)
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To communicate a change in the wafer fabrication and sort facility for all devices in the Platform Flash (XCF) and XC18V00 families of flash memory configuration PROMs devices. Was this document helpful? Yes | No
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1.1 |
68 KB |
10/05/2009 |