XCU099602 - XC4000 Dual Layer Metal (DLM) to Triple Layer Metal (TLM) Design Considerations (PDF)
Was this document helpful? Yes | No
|
1.0 |
18 KB |
09/27/1996 |
XCU099601 - Readback Specification Estabilished on XC4000/D/E (PDF)
Was this document helpful? Yes | No
|
1.0 |
13 KB |
09/15/1996 |
XCU019901 - Decision Not To Manufacture the XC4028XLA and the XC4036XLA in the HQ304 Package (PDF)
Was this document helpful? Yes | No
|
1.0 |
15 KB |
01/15/1999 |
XCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)
View Document Details
Xilinx is implementing a Warehouse Management System (WMS) in its internal warehouses worldwide. As a result, a license plate number (LPN), which is a unique tracking number, will now appear on labels beginning in August 2007. There are no changes to the form, fit, or function of the product. Was this document helpful? Yes | No
|
1.0 |
164 KB |
07/16/2007 |
XCN07010 - Product Discontinuance Update (PDF)
View Document Details
This notice describes the latest additions for obsolescence and should be considered in conjunction with previous discontinuance notices produced by Xilinx. Was this document helpful? Yes | No
|
1.0 |
50 KB |
05/14/2007 |
XCN07003 - Discontinuation of Low-Volume HQ Packages in the XC4000E, XC4000XL, XC4000XLA Product Fam (PDF)
View Document Details
Xilinx is discontinuing certain low-volume HQ package products in the XC4000E, XC4000XL, and XC4000XLA product families. All speed grades and temperature grades of these product offerings are affected, including Xilinx Military. Was this document helpful? Yes | No
|
1.0 |
34 KB |
02/19/2007 |
XCN05020 - Discontinue Low-Volume Members of the XC4000XL, XC4000E, XC9500XV, and XC3100A Families (PDF)
View Document Details
Xilinx is discontinuing low-volume device package-pin combinations of the XC4000E, XC4000XL, and XC9500XV product families, and all of the device/package/pin combinations of the XC3100A product families. Was this document helpful? Yes | No
|
1.1 |
143 KB |
03/10/2006 |
XCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion (PDF)
View Document Details
This notification describes a material set consolidation of mold compound and die-attach epoxy across various packages in all Xilinx device families. The new material set is already used in Xilinx RoHS-compliant products. There is no change to the form, fit, or function of the devices.
|
2.0 |
60 KB |
08/07/2006 |
PDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
07/01/1999 |
XC4000 devices available after PDN99003 (PDF)
Was this document helpful? Yes | No
|
1.0 |
37 KB |
04/19/1999 |
PDN99003 - Discontinue certain members of the XC4000 commercial & industrial product line (PDF)
Was this document helpful? Yes | No
|
1.0 |
44 KB |
04/19/1999 |
PDN99003 Data - XC4000 Devices which are NOT affected by PDN99003 (PDF)
Was this document helpful? Yes | No
|
1.0 |
29 KB |
04/19/1999 |
PDN99001 - Discontinue certain speed grades of the XC3000 & XC4000 SMD & M-Grade (PDF)
Was this document helpful? Yes | No
|
1.0 |
49 KB |
01/15/1999 |
PDN98006 - Discontinuation of the XC4003A M-grade and B-grade (SMD) Products (PDF)
Was this document helpful? Yes | No
|
1.0 |
18 KB |
06/26/1998 |
PDN98001 - Discontinuation of the MQFP package option in some XC4000 products (PDF)
Was this document helpful? Yes | No
|
1.0 |
21 KB |
06/15/1998 |
PDN2004-21 - Discontinue Low-Volume Members of the XC4000XL, XC4000XLA, and XC4000E Product Families (PDF)
Was this document helpful? Yes | No
|
1.1 |
245 KB |
11/15/2004 |
Supplemental List for PDN2002-03 (PDF)
Was this document helpful? Yes | No
|
1.0 |
611 KB |
04/01/2002 |
PDN2002-03 - Discontinue certain members of the XC4000, XC4000E, and XC4000L families (PDF)
Was this document helpful? Yes | No
|
1.1 |
76 KB |
04/01/2002 |
PDN2002-02 - Discontinuation of the XC4000XLT family (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
01/15/2002 |
PDN2002-01 - Discontinuation of the XC4000EX and XC4000XV families (PDF)
View Document Details
Discontinuance of all device/speed/package combinations of commercial and inductrial XC4000EXTM and XC4000XVTM product families. Was this document helpful? Yes | No
|
1.0 |
32 KB |
01/15/2002 |
PDN2001-03 - Withdrawal of certain commercial low volume device-speed combinations (XC4000XL) (PDF)
Was this document helpful? Yes | No
|
1.0 |
20 KB |
01/15/2001 |
PDN2001-02 - Withdrawal of certain commercial low volume device-package combinations (XC4000XL/XV) (PDF)
Was this document helpful? Yes | No
|
1.0 |
136 KB |
01/15/2001 |
PDN00001 - Low volume commercial device/package combinations (PDF)
Was this document helpful? Yes | No
|
1.0 |
28 KB |
01/15/2000 |
PCN99002 - Qualification Data for PCN99002 (wafer fabrication process change for XC4000XL) (PDF)
Was this document helpful? Yes | No
|
1.0 |
50 KB |
05/24/1999 |
PCN99002: A change in the wafer fabrication process used to fabricate the XC4000XL (C & I Grade) (PDF)
Was this document helpful? Yes | No
|
1.0 |
25 KB |
05/24/1999 |
PCN98007 - A change in the mold compound and die attach epoxy for Xilinx PLCC and QFP packages (PDF)
Was this document helpful? Yes | No
|
1.0 |
20 KB |
08/10/1998 |
PCN98007 Data - Package Qualification Testing Data for Mold Compound MP8000 (PDF)
Was this document helpful? Yes | No
|
1.0 |
18 KB |
08/10/1998 |
PCN98002A - Qualification of SPIL of Taiwan as an alternate Assembly Subcontractor (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
06/30/1998 |
PCN98002 - Qualification of SPIL of Taiwan as an alternate Assembly Subcontractor (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
05/18/1998 |
PCN98002 Data - Qualification Test Data for PCN98002 (SPIL Assembly) (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
05/18/1998 |
PCN97009A - A reissue of a minor enhancement to the Xilinx line of thermally enhanced quad flatpack (PDF)
Was this document helpful? Yes | No
|
1.0 |
19 KB |
10/29/1997 |
PCN97009A Data(2) - Reliability Testing of the HQ240 Package (Insulated Heatsink) (PDF)
Was this document helpful? Yes | No
|
1.0 |
13 KB |
10/29/1997 |
PCN97009A Data - Thermal Data for Thermally Enhanced Plastic Quad Flat Pack (PQFP) (PDF)
Was this document helpful? Yes | No
|
1.0 |
13 KB |
10/29/1997 |
PCN97007 - Conversion of Xilinx MIL-STD-883 Military Products to QML (PDF)
Was this document helpful? Yes | No
|
1.0 |
25 KB |
04/15/1997 |
PCN97007 Data - Cross Reference Listing (PDF)
Was this document helpful? Yes | No
|
1.0 |
31 KB |
04/15/1997 |
PCN97002 - Additional Product Assembly Qualification of A.S.E. Taiwan (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
02/15/1997 |
PCN97002 Data - Qualification of ASE for BGA Packages (PDF)
Was this document helpful? Yes | No
|
1.0 |
12 KB |
02/15/1997 |
PCN97001 - Qualification of ASTRA Microtronics Technology in Batam, Indonesia (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
02/28/1997 |
PCN97001 Data - Qualification Test Data (PDF)
Was this document helpful? Yes | No
|
1.0 |
10 KB |
02/28/1997 |
PCN96009 - Discontinuation of the XC4000A and XC4000H Product Families (PDF)
Was this document helpful? Yes | No
|
1.0 |
21 KB |
10/01/1996 |
PCN96008 - An evolutionary change in the Xilinx XC4000/D fabrication process (PDF)
Was this document helpful? Yes | No
|
1.0 |
21 KB |
10/01/1996 |
PCN96004 - A New Wafer Foundry Partner United Microelectronics Corporation (UMC) (PDF)
Was this document helpful? Yes | No
|
1.0 |
19 KB |
05/15/1996 |
PCN95013 - A minor change in the part marking methodology utilized for Xilinx Products (PDF)
Was this document helpful? Yes | No
|
1.0 |
24 KB |
12/26/1995 |
PCN95002B - An evolutionary change in the Xilinx wafer fabrication process (PDF)
Was this document helpful? Yes | No
|
1.0 |
18 KB |
06/18/1995 |
PCN95002A - An evolutionary change in the Xilinx wafer fabrication process (PDF)
Was this document helpful? Yes | No
|
1.0 |
17 KB |
08/11/1995 |
PCN95002 - An evolutionary change in the Xilinx XC4000 fabrication process (PDF)
Was this document helpful? Yes | No
|
1.0 |
18 KB |
04/06/1995 |
PCN2004-28 - Humidity Indicator Card (HIC) Change (PDF)
View Document Details
Xilinx is changing from a 6 dot HIC to a 3 dot HIC to comply with industry standard dry packing requirements, JEDEC standard J-STD-033. Was this document helpful? Yes | No
|
1.0 |
161 KB |
12/06/2004 |
PCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material) (PDF)
Was this document helpful? Yes | No
|
1.1 |
72 KB |
12/06/2004 |
PCN2002-08 - Change in shipping trays for CB packages (PDF)
Was this document helpful? Yes | No
|
1.0 |
39 KB |
06/11/2002 |
PCN2000-06 - Minor Modification in Thermally Enhanced BG and FG Package Outline Specifications (PDF)
Was this document helpful? Yes | No
|
1.0.1 |
41 KB |
03/13/2007 |
PCN1996-08 Data - Device Qualification Data (PDF)
Was this document helpful? Yes | No
|
1.0 |
21 KB |
10/01/1996 |
PCN00003 - A Change in the die-attach material for all thermally enhanced BGA packages (PDF)
Was this document helpful? Yes | No
|
1.0 |
20 KB |
08/03/2000 |
Advisory 2003-02 - Change in BGA Shipping Trays (PDF)
View Document Details
Xilinx is changing the primary supplier for Ball Grid Array (BGA) shipping trays from Peak to both
Daewon and Kostat. Was this document helpful? Yes | No
|
1.0 |
43 KB |
08/19/2003 |
XCN06002 - Discontinuation of Certain Military and Radiation-Tolerant Devices (PDF)
View Document Details
Xilinx is discontinuing certain low-demand military and radiation-tolerant products. Was this document helpful? Yes | No
|
1.0 |
52 KB |
01/30/2006 |
XCN07022 - Product Discontinuation Notice (PDF)
View Document Details
Xilinx is discontinuing certain Spartan®, XC4000XL, CoolRunner™, and Programming Solution products. Was this document helpful? Yes | No
|
1.0.2 |
75 KB |
07/28/2008 |
PCN95006 - A minor change to the electrical specifications of some Xilinx Ceramic Packaged Devices (PDF)
Was this document helpful? Yes | No
|
1.0 |
14 KB |
08/22/1995 |
PCN95007 - Qualification of Integrated Packaging Assembly Corporation (PDF)
Was this document helpful? Yes | No
|
1.0 |
17 KB |
12/11/1995 |
PCN95008 - Qualification of AAPI-1 Assembly Facility (PDF)
Was this document helpful? Yes | No
|
1.0 |
17 KB |
12/11/1995 |
PCN95009 - Qualification of the Advanced Semiconductor Engineering, (PDF)
Was this document helpful? Yes | No
|
1.0 |
17 KB |
12/11/1995 |
XCN09001 - Product Discontinuation Notice (PDF)
View Document Details
To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products. Was this document helpful? Yes | No
|
1.2 |
63 KB |
06/15/2009 |