XC9500

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XC9500 Data Sheets

NameDoc VersionSizeDate
PDFXC9500 5V In-System Programmable CPLD Family (PDF)

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5.5 169 KB 06/25/2007
PDFXC95288 5V In-System Programmable CPLD (PDF)

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4.3 115 KB 04/03/2006
PDFXC95216 5V In-System Programmable CPLD (PDF)

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4.4 100 KB 06/25/2007
PDFXC95144 In-System Programmable CPLD (PDF)

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5.6 188 KB 04/03/2006
PDFXC95108 In-System Programmable CPLD (PDF)

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4.4 190 KB 04/03/2006
PDFXC9572 5V In-System Programmable CPLD (PDF)

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4.5 104 KB 04/03/2006
PDFXC9536 5V In-System Programmable CPLD (PDF)

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6.3 99 KB 04/03/2006
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XC9500 User Guides

NameDoc VersionSizeDate
PDFCPLD I/O User Guide (PDF)

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1.1 610 KB 11/27/2007
PDFDevice Reliability Report (PDF)

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4.3 919 KB 02/06/2008
PDFDevice Package User Guide (PDF)

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3.0 4.47 MB 05/18/2007
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XC9500 Errata

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XC9500 Customer Notices

NameDoc VersionSizeDate
PDFXCU2000-03 - Addition of PPT as a Substrate Supplier (PDF)
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1.0 22 KB 11/14/2002
PDFXCN07012 - License Plate Number (LPN) Added to All Customer Labels (PDF)

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1.0 164 KB 07/16/2007
PDFXCN07010 - Product Discontinuance Update (PDF)

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1.0 50 KB 05/14/2007
PDFXCN06016 - New Assembly Partner: STATS ChipPAC Singapore (SCS) (PDF)

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Design Files: Qualification Report for XCN06016
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1.1 115 KB 12/25/2006
PDFXCN05011 - Mold Compound & Die-Attach Epoxy Material Conversion (PDF)

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Design Files: Qualification Report for XCN05011
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2.0 60 KB 08/07/2006
PDFPDN99004 - Discontinuance of Die and Wafer Sales for all Xilinx Product Families (PDF)
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1.0 24 KB 07/01/1999
PDFPCN98003 - The Xilinx XC9500 Product Family will be manufactured in the 0.5uM Flash Process at UMC (PDF)
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1.0 24 KB 07/24/1998
PDFPCN98003 Data - Qualification Test Data (PDF)
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1.0 34 KB 06/24/1998
PDFPCN97009A - A reissue of a minor enhancement to the Xilinx line of thermally enhanced quad flatpack (PDF)
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1.0 19 KB 10/29/1997
PDFPCN97009A Data(2) - Reliability Testing of the HQ240 Package (Insulated Heatsink) (PDF)
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1.0 13 KB 10/29/1997
PDFPCN97009A Data - Thermal Data for Thermally Enhanced Plastic Quad Flat Pack (PQFP) (PDF)
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1.0 13 KB 10/29/1997
PDFPCN2004-28 - Humidity Indicator Card (HIC) Change (PDF)

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1.0 161 KB 12/06/2004
PDFPCN2004-05 - New Material Set and Part Marking for Chip Scale BGA Packages (PDF)
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1.1 72 KB 12/06/2004
PDFPCN2003-11 - Conversion to Green Material Set (Mold Compound and Die Attach Material) (PDF)
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1.1 72 KB 12/06/2004
PDFPCN2000-06 - Minor Modification in Thermally Enhanced BG and FG Package Outline Specifications (PDF)
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1.0.1 41 KB 03/13/2007
PDFAdvisory 2003-02 - Change in BGA Shipping Trays (PDF)

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1.0 43 KB 08/19/2003
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XC9500 Application Notes

NameDoc VersionSizeDate
PDFXAPP805 - Driving LEDs with Xilinx CPLDs (PDF)

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1.0 254 KB 04/08/2005
PDFXAPP110 - XC9500 CPLD Power Sequencing (PDF)

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1.0 29 KB 02/16/1998
PDFXAPP105 - A CPLD VHDL Introduction (PDF)

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2.0 335 KB 08/30/2001
PDFXAPP501 - Configuration Quick Start Guidelines (PDF)

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1.5 249 KB 10/02/2007
PDFXAPP440 - Power On Behavior of Xilinx CPLDs (PDF)

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1.0 85 KB 05/25/2006
PDFXAPP150 - I/V Curves for Various Device Families (PDF)

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1.1 138 KB 05/15/2001
PDFXAPP144 - Designing CPLD Multi-voltage Systems (PDF)

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1.3 66 KB 03/14/2000
PDFXAPP143 - Using Verilog to Create CPLD Designs (PDF)

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1.0 377 KB 08/22/2001
PDFXAPP137 - Configuring Virtex FPGAs from Parallel EPROMs with a CPLD (PDF)

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Design Files: xapp137.zip
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1.0 81 KB 03/01/1999
PDFXAPP113 - Faster Erase Times for XC95216 and XC95108 Devices on HP 3070 Series Testers (PDF)

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1.2 63 KB 08/26/2003
PDFXAPP104 - A Quick JTAG ISP Checklist (PDF)

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3.0.1 55 KB 12/20/2007
PDFXAPP100 - Choosing a Xilinx Product Family (PDF)

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1.4 35 KB 12/03/1998
PDFXAPP079 - Configuring Xilinx FPGAs Using an XC9500 CPLD and Parallel PROM (PDF)

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1.1 105 KB 07/27/2000
PDFXAPP076 - Embedded Instrumentation Using XC9500 CPLDs (PDF)

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1.0 31 KB 01/01/1997
PDFXAPP073 - Designing with XC9500 CPLDs (PDF)

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1.3 60 KB 01/01/1998
PDFXAPP071 - Using the XC9500 Timing Model (PDF)

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1.0 38 KB 01/01/1997
PDFXAPP070 - Using In-System Programming in Boundary-Scan Systems (PDF)

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2.1.1 136 KB 11/15/2007
PDFXAPP069 - Using the XC9500 JTAG Boundary Scan Interface   (PDF)

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3.1 464 KB 12/10/2002
PDFXAPP068 - In-System Programming Times (PDF)

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1.2 14 KB 04/01/1998
PDFXAPP067 - Using Serial Vector Format Files to Program XC9500 Devices In-System (PDF)

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2.0 123 KB 05/13/2002
PDFXAPP058 - Xilinx In-System Programming Using an Embedded Microcontroller (PDF)

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Design Files: eisp_pc.zip
eisp_sol.tar.Z
eisp_hp.tar.Z
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4.0 997 KB 10/01/2007
PDFXAPP1047 - CPLD Timing (PDF)

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1.0 242 KB 02/07/2008
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XC9500 Package Specifications

NameDoc VersionSizeDate
PDFBGG352 - Material Declaration Data Sheet (Pb-free Metal BGA Cavity Down) (PDF)
Design Files: IPC-1752 Form
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1.0.1 83 KB 01/08/2007
PDFBG352 - Material Declaration Data Sheet (Standard Metal BGA Cavity Down) (PDF)
Design Files: IPC-1752 Form
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1.0.1 81 KB 01/08/2007
PDFVQ44 - Material Declaration Data Sheet (Standard VQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 10/05/2006
PDFTQ100 - Material Declaration Data Sheet (Standard TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 09/29/2006
PDFPQ208 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 109 KB 10/19/2006
PDFPQ160 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 81 KB 10/19/2006
PDFPQ100 - Material Declaration Data Sheet (Standard PQFP) (PDF)
Design Files: IPC-1752 Form
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1.3.1 82 KB 10/19/2006
PDFHQ208 - Material Declaration Data Sheet (Standard Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 85 KB 10/03/2006
PDFPD8 - Material Declaration Data Sheet (Standard Plastic DIP) (PDF)
Design Files: IPC-1752 Form
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1.2 81 KB 09/29/2006
PDFVQ44/VQG44 - Package Drawing (VQFP) (PDF)
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1.2 121 KB 06/18/2004
PDFTQ100/TQG100 - Package Drawing (TQFP) (PDF)
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1.2 147 KB 06/18/2004
PDFPQ208/PQG208 - Package Drawing (PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFPQ160/PQG160 - Package Drawing (PQFP) (PDF)
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1.2 154 KB 06/18/2004
PDFPQ100 - Package Drawing (Standard PQFP) (PDF)
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1.2 73 KB 10/17/2002
PDFPC44 - Material Declaration Data Sheet (Standard PLCC) (PDF)
Design Files: IPC-1752 Form
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1.2 78 KB 09/29/2006
PDFCS48 - Material Declaration Data Sheet (Standard Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.2 83 KB 09/28/2006
PDFVQG44 - Material Declaration Data Sheet (Pb-free VQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 80 KB 09/28/2006
PDFTQG100 - Material Declaration Data Sheet (Pb-free TQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 80 KB 10/19/2006
PDFPQG160 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2.1 81 KB 10/19/2006
PDFPQG100 - Material Declaration Data Sheet (Pb-free PQFP) (PDF)
Design Files: IPC-1752 Form
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1.3.1 81 KB 10/19/2006
PDFHQG208 - Material Declaration Data Sheet (Pb-free Heat Sink PQFP) (PDF)
Design Files: IPC-1752 Form
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1.2 83 KB 09/28/2006
PDFPDG8 - Material Declaration Data Sheet (Pb-free Plastic DIP) (PDF)
Design Files: IPC-1752 Form
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1.2 80 KB 09/28/2006
PDFCSG48 - Material Declaration Data Sheet (Pb-free Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
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1.3 86 KB 09/28/2006
PDFPC44/PCG44 - Package Drawing (PLCC) (PDF)
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1.2 90 KB 06/18/2004
PDFHT100/HTG100 - Package Drawing (Heat Sink TQFP) (PDF)
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1.2 148 KB 06/18/2004
PDFHQ208/HQG208 - Package Drawing (Heat Sink PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFHQ160/HQG160 - Package Drawing (Heat Sink PQFP) (PDF)
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1.2 155 KB 06/18/2004
PDFPD08 - Package Drawing (Standard Plastic DIP) (PDF)
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1.1 28 KB 04/06/2001
PDFCS48/CSG48 - Package Drawing (Chip Scale BGA) (PDF)
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1.2.1 74 KB 04/12/2005
PDFBG352 - Package Drawing (Standard Metal BGA Cavity Down) (PDF)
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1.1 50 KB 04/06/2001
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XC9500 Characterization Reports

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XC9500 White Papers

NameDoc VersionSizeDate
PDFWP214 - TTL "Burn Rate" for Xilinx CPLDs (PDF)

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1.0 1.35 MB 01/10/2005
PDFWP125 - Xilinx at Work in ISDN Modems (PDF)

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1.0 65 KB 05/19/1999
PDFWP124 - Xilinx at Work in Digital Modems (PDF)

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1.0 76 KB 05/19/1999
PDFWP120 - Xilinx High-Volume Programmable Logic Applications in Satellite Modem Designs (PDF)

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1.0 74 KB 07/21/2000
PDFWP103 - Xilinx High Volume Programmable Logic Applications in Internet Audio Players (PDF)

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1.0 118 KB 01/17/2000
PDFWP102 - Xilinx at Work in Digital Printers (PDF)

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1.0 90 KB 12/13/1999
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