Enabling Next Generation Aerospace and Defense Systems

Product Advantages

Defense-Grade Zynq UltraScale+ RFSoC Product Advantages

XQ Zynq™ UltraScale+™ RFSOCs enable designers with a broad selection of devices to advance state-of-the-art integrated Aerospace & Defense solutions, with the industry’s first heterogeneous multi-processor SOC devices with flexible and dynamically reconfigurable high-performance programmable logic and DSP, 28Gb/s transceivers, quad-core ARM® Cortex®-A53, dual-core ARM® Cortex®-R5 embedded processors, and optional features of high-speed 4GSPS ADCs and 6.4GSPS DACs, optional 256-bit PUF, and ruggedized-packages with support for -55C to +125C operation.

Integrated RFSoC Device Features Benefits of Integrated Zynq UltraScale+ RFSoC
  • Ruggedized package, fully <97% Sn on all solder points
  • Full junction temperature support  –55°C to +125°C
  • Mil Std 883 Group D environmental characterization
  • Mask set control
  • Anti-counterfeit marking
  • Quad-core ARM Cortex-A53 MPCore up to 1.33GHz
  • Dual-core ARM Cortex-R5 MPCore up to 533MHz
  • RF/Analog Features:  SD-FEC, 14-bit 6.4 GS/s DAC, 12-bit 4 GS/s ADC
  • 930K System Logic Cells
  • 4,272 DSP Slices
  • Enhanced security plus available 256bit PUF
  • ECC on all memories
  • Supports DDR4/3/3L, LPDDR4/3, 32/64b with ECC
  • Up to 2X PCIe Gen4x8/3x16 plus 1X PCIe Gen2 x4\
  • Up to 16X GTY 28.2Gb/s
  • Integrated high-speed analog eliminates other high-cost components
  • Robust packaging meeting harsh environmental needs
  • Ease burden to meet DOD anti-counterfeiting requirements
  • Eliminate high-speed chip to chip connectivity
  • Simplified system design with shared Processing and FPGA memory
  • Reduced programmable logic needs due to eliminated interfaces
  • Simplified design,
  • Reduced size, weight, and power
  • Increased computed density and efficiency
Product Table

Processing System (PS)

Features All Devices
Application Processing Unit Quad-core ARM Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point; 32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Unit Dual-core ARM Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1 Cache, and TCM
Embedded and External
Memory256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3; External Quad-SPI; NAND; eMMC
General Connectivity

214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple Timer Counters

High-Speed Connectivity 4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII

Programmable Logic (PL)

System Logic Cells (K) 930 930 930 930 930
Memory (Mb) 60 60 60 60 60
DSP Slices 4272 4272 4272 4272 4272
12-bit, 4.096GSPS ADC - 8 - - -
12-bit, 2.058GSPS ADC - - 16 - -
14-bit, 6.554GSPS DAC - 8 16 - -
14-bit, 2.5GSPS ADC - - - - 16
14-bit, 5GSPS ADC - - - 8 -
14-bit, 10GSPS DAC - - - 8 16
SD-FEC 8 8 - 8
GTY 28.2 Gb/s Transceivers 16 16 16 16
Maximum I/O Pins 280 347 408 347
Available M-temp -55C to +125C Yes Yes Yes Yes Yes
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