- Ruggedized package, fully <97% Sn on all solder points
- Full junction temperature support –55°C to +125°C
- Mil Std 883 Group D environmental characterization
- Mask set control
- Anti-counterfeit marking
- Quad-core Arm Cortex-A53 MPCore up to 1.33 GHz
- Dual-core Arm Cortex-R5 MPCore up to 533 MHz
- RF/Analog Features: SD-FEC, 14-bit 6.4 GS/s DAC, 12-bit 4 GS/s ADC
- 930K System Logic Cells
- 4,272 DSP Slices
- Enhanced security plus available 256 bit PUF
- ECC on all memories
- Supports DDR4/3/3L, LPDDR4/3, 32/64b with ECC
- Up to 2X PCIe Gen4x8/3x16 plus 1X PCIe Gen2x4\
- Up to 16X GTY 28.2 Gb/s
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- Integrated high-speed analog eliminates other high-cost components
- Robust packaging meeting harsh environmental needs
- Ease burden to meet DOD anti-counterfeiting requirements
- Eliminate high-speed chip to chip connectivity
- Simplified system design with shared Processing and FPGA memory
- Reduced programmable logic needs due to eliminated interfaces
- Simplified design,
- Reduced size, weight, and power
- Increased computed density and efficiency
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