FPGA Leadership across Multiple Process Nodes
AMD offers a comprehensive multi-node portfolio to address requirements across a wide set of applications. Whether you are designing a state-of-the-art, high-performance networking application requiring the highest capacity, bandwidth, and performance, or looking for a low-cost, small footprint field-programmable gate array (FPGA) to take your software-defined technology to the next level, AMD FPGAs and 3D ICs provide you with system integration while optimizing for performance/watt.
The combination of TSMC’s 16nm FinFET process with new UltraRAM and SmartConnect technologies enables AMD to continue delivering ‘More than Moore’s Law’ value to the market.
AMD enhanced FPGA architecture that contains a step-function increase in both the amount of connectivity resources and the associated inter-die bandwidth in this second-generation 3D IC architecture.
Continuous innovation on the process node enables new devices with optimal performance at the lower power across product families to meet requirements for key applications..
AMD offers exceptional connectivity features such as high logic-to-pin ratios, small form-factor packaging, MicroBlaze™ soft processor, and a diverse number of supported I/O protocols.